2-640463-2 Price & Stock

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Manufacturer
Connectors, Interconnects > Sockets for ICs, Transistors
CONN IC DIP SOCKET 8POS GOLD
Specifications
Series Diplomate DL
Part Status Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 8 (2 x 4)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 30µin (0.76µm)
Contact Material - Post Beryllium Copper
Housing Material Thermoplastic, Glass Filled
Operating Temperature -55°C ~ 125°C
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