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Manufacturer
Connectors, Interconnects > Sockets for ICs, Transistors
CONN IC DIP SOCKET ZIF 40POS TIN
Specifications
| Series | Lo-PRO®file, 526 |
| Part Status | Active |
| Type | DIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 10µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 10µin (0.25µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | -55°C ~ 105°C |
Specifications
| Product Range | 526 Series |
| Connector Type | DIP |
| No. of Contacts | 40Contacts |
| Pitch Spacing | 2.54mm |
| Row Pitch | 15.24mm |
| Contact Plating | Tin Plated Contacts |
| Contact Material | Beryllium Copper |
| SVHC | No SVHC (17-Dec-2015) |
| Connector Mounting Orientation | PC Board |
| Contact Termination | Through Hole Vertical |
| Contact Termination Type | Through Hole |
| Lead Spacing | 2.54mm |
| Pin Format | DIP |
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