3-1571586-2 Price & Stock

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Manufacturer
Connectors, Interconnects > Sockets for ICs, Transistors
CONN IC DIP SOCKET 40POS GOLD
Specifications
Series 800
Part Status Active
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 40 (2 x 20)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 25µin (0.63µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 25µin (0.63µm)
Contact Material - Post Copper
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature -55°C ~ 105°C
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sku #: 315715862
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