20-822-90E Price & Stock

Manufacturer
Connectors, Interconnects > Sockets for ICs, Transistors
CONN IC DIP SOCKET 20POS TIN
Specifications
Series Vertisockets™ 800
Part Status Active
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 20 (2 x 10)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 50µin (1.27µm)
Contact Material - Mating Phosphor Bronze
Mounting Type Through Hole, Right Angle, Horizontal
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 50µin (1.27µm)
Contact Material - Post Phosphor Bronze
Housing Material Polyamide (PA46), Nylon 4/6
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